0.8 I-Pitch Connector Isingeniso Sisonke
Ibhodi Lomugqa Ophindwe Kabili Ukuze Ibhodi Isixhumi
● Umqondo
I-Plastron's 0.8mm BTB iyisixazululo esivumelana nezimo esiklanyelwe isivinini esikhulu kanye nohlelo lokuxhumanisa lwebhodi ukuya ebhodini oluhambisana nebhodi ukuya ebhodini olunobude besitaki abangu-16 PCB ngosayizi abayisi-9 abafika ezindaweni eziyi-140.
• Iphrofayili yezindlu netheminali iqinisekisa isivinini sokudluliswa kwedatha esingafika ku-12Gb/s
• Ukumisa ukukhwelana okuqondile kuqhathaniswa okuqondile
• 30 kuya ku-140 osayizi bezikhundla ekukhuphukeni kwezikhundla ezingama-20
● Ulwazi Lobuchwepheshe
Ukuphakama: 0.8 mm
Inombolo yamaphini: 30~140pin
Indlela yokushisela ye-PCB: SMT
Indawo yokudokha: 180 degree docking mpo
Indlela ye-Electroplating: Igolide / Ithini / Igolide-flash
PCB Docking ubude: 5mm ~ 20mm (16 izinhlobo ukuphakama)
● Imininingwane
● Ubuqotho besignali
Ukuqina: Imijikelezo yokukhwelana eyi-100
Amandla okukhwelana: 150gf max./ Xhumana namabhangqa
Amandla angalingani: 10gf min./ Xhumana namabhangqa
Izinga lokushisa lokusebenza: -40 ℃ ~ 105 ℃
Impilo yokushisa ephezulu: 105±2℃, amahora angama-250
Ukumelana ne-insulation: 100 MΩ
Ilinganiselwe lamanje: 0.5~1.5A/iphinikhodi
Ukumelana nokuxhumana: 50mΩ
I-voltage elinganiselwe: 50V ~ 100V AC/DC
Izinga lokushisa eliqhubekayo kanye nomswakama: Umswakama ohlobene 90~95% amahora angu-96
Ibanga elihlukile le-impedance: 80~110Ω 50ps(10~90%)
Ukulahlekelwa kokufaka: ＜1.5dB 6GHz/12Gbps
Ukulahleka kokubuyisela: ＜ 10dB 6GHz/12Gbps
I-Crosstalk: ≤ -26 dB 50ps(10~90%)
Umqondo
● Izici
Inzuzo
● Idizayini Yetheminali Ethembeke Kakhulu
• Iphuzu lokuxhumana elicijile lingafinyelela amandla amakhulu okuqinisekisa ukuthintana okuthembekile
• Isakhiwo setheminali esiyingqayizivele esiklanyelwe ukudluliswa kwefrikhwensi ephezulu
● Faka i-Face Chamfer
• Amathiphu okuxhumana ahlanganisiwe aqinisekisa isenzo sokusula esibushelelezi, esiphephile ngesikhathi sokukhwelana kwesixhumi
● I-Male End Material
Udwendwe Nempahla
● Izinto Zokuphela Kwabesifazane
I-Automatic Assembly ngokugcwele kanye ne-Reflow Soldering
Ingxenye Inombolo Matrix
Izimpawu Zemvamisa Ephakeme
Izici
Iphrofayili yezindlu netheminali iqinisekisa ukusekelwa okufika ku-12Gb/s
Ihambisana ne-PCIe Gen 2/3 kanye nokusebenza kwesivinini esiphezulu kwe-SAS 3.0 ezindaweni ezikhethiwe eziphakeme
Umehluko we-Lmpedance
Ukulahlekelwa Kokufaka
Buyisela Ukulahlekelwa
Eduze kwe-End Crosstalk (NEXT)
Far End Crosstalk
